THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilize advanced TOSHIBA NAND flash device(s) and co*oller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use. THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode. 需要的亲，Q我 1242388708 标签： 东芝存储 环保无铅 4GB 东芝存储eMMC 环保无铅 4GB 北京市THGBMBG5D1KBAIL 北京市THGBMBG5D1KBAIL厂家 [东芝存储eMMC
环保无铅
4GB]
北京市THGBMBG5D1KBAIL厂家 东芝4GB存储eMMC，环保无铅，THGBMBG5D1KBAIL
北京芯时代电子科技发展有限公司
